Technical Capabilities

Assembly & Process Capabilities
  • SMT BGA & Micro BGA
  • Automated Through Hole
  • Box Build / Integration
  • Fine Pitch & BGA Rework
  • Leaded and Lead Free Processes
  • Inventory Turnkey & Consigned
  • Prototypes
  • Low & Medium Volume Assembly
Test & Design
  • Full Product Design & Engineering
  • PCB Design & Layout
  • Design For Manufacturability
  • Design for Testability
  • Functional, AOI & ICT Testing
  • Circuit Trouble Shooting & Analysis
  • RF & Wireless Testing
Quality Standards
  • ISO 9001:2008
  • IPC/EIA J STD 001C Complaint
  • IPC-A610-D Workmanship Standard
  • ITAR Compliant
  • Training & Certification Program

Equipment Listing
Screen Printers
  • MPM Automatic Screen Printers w/Vision
  • Dual Head Screen Printer with Double Nest, Dual Squeegee Head and Vertical Breakaway
Solder Reflow
  • HELLER 8-Zone Convection Reflow Oven
  • 2 – HELLER 4-Zone Convection Reflow Ovens
  • DATAPAQ 6-channel MOLE
Optical inspection
  • NICOLET Model 1400 X-Ray Inspection Station
  • MIRTEC Model MV-2HTLP Automated Optical Inspection
  • SONY TECHNOLOOK TW-TLIS Video Microscope
  • ERSA BGA Inspection Microscope
Test
  • GenRad Model GR 2286 ICT
  • Acculogic "Sprint" Flying Probe System with AFTS
  • Full complement of functional test and diagnostic equipment.
Solder Paste Measurement
  • ASC International Solder Paste Inspection Station
Aqueous Cleaning
  • AQUACYCLER 250-gallon/5 gallon per minute closed Loop DI recirculation system
  • VITRONICS In-Line, 4-Chamber Automatic Aqueous wash
  • AQUEOUS TECHNOLOGIES AQ201 Cleaning Station with Water Recycler
  • GRIEVE 343 Process Oven
Miscellanenous Production
  • HELLER & MANNIX Forming/Cutting Equipment
  • VISION ENGINEERING Mantis Vision System
  • 100% METCAL State-of-the-Art Soldering Stations
  • PACE De-soldering Stations
  • OK INDUSTRIES FCR-2000 Focused Convection Rework Stations
  • OK INDUSTRIES SA-5201 Solder Fountains
 Placement Machines
  • MYDATA MY12 Pick & Place Machine with HYDRA Speedmount (21,000chp), Electrical Component Verification, Smart and Leaderless Feeders.
  • MYDATA TP11-UFP-Hydra SpeedMount (14,000cph) Pick & Place Machine with Electrical Component Verification & Chip Shooter with Smart Feeder.
  • MYDATA TP9-2U SMT Pick & Place Machines with Electrical Component Verification with Smart Feeder.
Through-hole
  • Contact Systems CS400 Semi-Automatic Insertion Machine
  • Manual Insertion/Slide Lines
  • FUSION Model 1600 Wave Soldering Machine
  • WENESCO Lead-free Selective Soldering Station